Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Evaluation of Thermal Property and Fluidity with Underfill for BGA Package

BGA 패키지를 위한 언더필의 열적 특성과 유동성에 관한 연구

  • Noh, Bo-In (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Lee, Bo-Young (Department of Aerospace and Mechanical Engineering, Hankuk Aviation University) ;
  • Kim, Soo-Jung (Department of Aerospace and Mechanical Engineering, Hankuk Aviation University) ;
  • Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
  • 노보인 (성균관대학교 신소재공학부) ;
  • 이보영 (한국항공대학교 항공우주 및 기계공학부) ;
  • 김수종 (한국항공대학교 항공우주 및 기계공학부) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Published : 2006.04.01
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Abstract

In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster.

Keywords

References

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