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A Studying on the Crosstalk Characteristic of mm-wave Coplanar-waveguide

극초고주파용 CPW의 결합노이즈특성에 관한 연구

  • Published : 2006.02.01

Abstract

The purpose of this research is to establish the crosstalk characteristic of mm-wave Coplanar structure. The components in mm-wave CPW are classified to transmission devices, EM devices, and quasi - TEM devices. After design of these devices, we analyzed these CPW s electromagnetically using FDTD method, and suggested the corsstalk characteristic of mm-wave CPW. In oder to realize a CPW module up to 30 GHz-100 GHz band, we research on a technology of 3-dimensional mm-wave CPW, and GaAs substrate with ohmic lossy layer. As a result this research, we suggested the optimum crosstalk characteristic of mm-wave CPW, and improved the crosstalk quality of mm-wave CPW.

Keywords

References

  1. T. Krems, W. H. Haydl, H. Massier, and J. Rudiger, 'Advantages of flip chip technology in millimeter-wave packaging', IEEE MTI-S Int. Microwave Symp. Dig., p. 987, 1997
  2. R. F. Harrington, 'Field Computation by Moment Methods', New York: IEEE Press, 1993
  3. H. Y. Wang, D. Mirshekar, and I. Dilworth, 'Spectral domain analysis of coplanar strip discontinuities', Microwave and Optical Technology Letters, Vol. 15, No.6, p. 395, 1997
  4. A. Taflove, 'Computational Electromagnetics: The Finite-difference Time-domain Method', Artech House, Boston, 1995
  5. A. J. Sangster and H. Y. Wang, 'Generalized analysis for a class of rectangular waveguide coupler employing narrow wall slots', IEEE Trans. on Microwave Theory and Technology, Vol. 44, No.2, p. 283, 1996
  6. 김용권, 박윤경 'Ultra thin 실리콘 웨이퍼를 이용한 RF-MENS 소자의 웨이퍼레벨 패키징', 전기전자재료학회논문지, 16권, 12호, p. 1237, 2003
  7. R. N. Simons, N. I. Dib, and L. P. B. Katehi, 'Modeling of coplanar stripline discontinuities', IEEE Trans. on Microwave Theory and Technology, Vol. 44, No.5, p. 711, 1996
  8. Y. Gao and I. Wolff, 'Miniature electric near-field probes for measuring 3-D fields in planar microwave circuits', IEEE Trans. on Microwave Theory and Technology, Vol. 46, No.7, p. 907, 1998 https://doi.org/10.1109/22.701442
  9. H.-Y. Lee, ' Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits', IEEE Trans. Microwave Theory and Tech, Vol. MTT-43, No.1, p. 63, 1995
  10. T. Krems, W. Haydl, H. Massler, and J. Rudiger, 'Millimeter-wave performance of interconnections using wire bonding and flip chip', Proc. IEEE MTT-s. Dig., San Francisco, CA, p. 247, 1996