Journal of Welding and Joining

  • 제24권6호
  • /
  • Pages.21-27
  • /
  • 2006
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

무연 솔더가 적용된 자동차 전장부품 접합부의 열적.기계적 신뢰성 평가

Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application

  • 하상수 (성균관대학교 신소재공학과) ;
  • 김종웅 (성균관대학교 신소재공학과) ;
  • 채종혁 (현대.기아 연구개발 본부 전자신뢰성 연구팀) ;
  • 문원철 (성균관대학교 마이크로전자패키징 사업단) ;
  • 홍태환 (충주대학교 신소재공학과) ;
  • 유충식 (삼성전기 WS모듈사업팀 제조기술 Group) ;
  • 문정훈 (수원과학대학 일렉트로닉스패키징과) ;
  • 정승부 (성균관대학교 신소재공학과)
  • Ha, Sang-Su (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Kim, Jong-Woong (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Chae, Jong-Hyuck (Research & Development Division for Hyundai Motor Company & Kia Motors Corporation) ;
  • Moon, Won-Chul (Sungkyunkwan University, Micro Electro Packaging Consortium) ;
  • Hong, Tae-Hwan (School of Advanced Materials Science and Engineering, Chungju National University) ;
  • Yoo, Choong-Sik (Manufacturing Technology Group, WS Module Business Team, Samsung Electro-Mechanics) ;
  • Moon, Jeong-Hoon (Department of Electronics Packaging, Suwon Science College) ;
  • Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
  • 발행 : 2006.12.31
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초록

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

키워드

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