References
- G. A. Slack and V. G. Tsoukala, J. Appl. Phys., 76, 1665 (1994) https://doi.org/10.1063/1.357750
- I.-H. Kim, G.-S. Choi, M.-G. Han, J.-S. Kim, J.-I. Lee, S.C. Ur, T.-W.- Hong, Y.-G. Lee and S.-L. Ryu, Mater. Sci. Forum., 449, 917 (2004) https://doi.org/10.4028/www.scientific.net/MSF.449-452.917
- T. Caillat, A. Borshchevsky and J.-P. Fleurial, J. Appl. Phys., 80, 4442 (1996) https://doi.org/10.1063/1.363405
- Y. Kawaharada, K. Kurosaki, M. Uno and S. Yamanaka, J. Alloys & Comp., 375, 193 (2001) https://doi.org/10.1016/S0925-8388(00)01275-5
- K.T. Wojciechowski, J. Tobola and J. Leszczynski, J. Alloys & Comp., 361, 19 (2003) https://doi.org/10.1016/S0925-8388(03)00411-0
- I.-H. Kim, K.-H. Park, D.-W, Koh, S.-W. You and S.-C. Ur, Sol. Sta. Phen. (2006, submitted)
- S. Katsuyama, M. Watanabe, M. Kuroki, T. Maehata and M. Ito, J. Appl. Phys., 93(5), 2758 (2003) https://doi.org/10.1063/1.1545158
- S. Katsuyama, Y. Shichijo, M. Ito, K. Majima and H. Nagai, J. Appl. Phys., 84(12), 6708 (1998) https://doi.org/10.1063/1.369048
- K. Matsubara, T. Sakakibara, Y. Notohara, H. Anno, H. Shimuzu and T. Koyanagi, Proc. 15th IntI. Conf. Thermoelectrics, 96 (1996) https://doi.org/10.1109/ICT.1996.553264