유기솔더 보존제용 폴리(비닐 피리딘) 공중합체의 합성 및 특성평가

Preparation and Evaluation of Poly(vinyl pyridine) Copolymers for Organic Solderability Preservatives

  • 임정혁 (충남대학교 바이오응용화학부 화학공학) ;
  • 이현준 (충남대학교 바이오응용화학부 화학공학) ;
  • 허강무 (충남대학교 바이오응용화학부 화학공학) ;
  • 김창현 (호남석유화학) ;
  • 이효수 (생산기술연구원) ;
  • 이창수 (충남대학교 바이오응용화학부 화학공학) ;
  • 최호석 (충남대학교 바이오응용화학부 화학공학)
  • Im, Jeong-Hyuk (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Lee, Hyun-Jun (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Huh, Kang-Moo (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Kim, Chang-Hyeon (Daedeok Research Institute, Honam Petrochemical Co.) ;
  • Lee, Hyo-Soo (Nano Material Team, Advanced Material Center, Korea Instiutte of Industrial Technology) ;
  • Lee, Chang-Soo (School of Applied Chemistry and Biological Engineering, Chungnam National University) ;
  • Choi, Ho-Suk (School of Applied Chemistry and Biological Engineering, Chungnam National University)
  • 발행 : 2006.11.30

초록

나노피막을 형성하는 유기솔더 보존제의 주성분인 저분자 imidazole계 유기물을 대체할 수 있는 고분자 물질을 합성하였다. Cu와 같은 금속과의 접착성이 종은 비닐 피리딘을 주요 단량체로 하였고 물성 개질을 위한 공중합용 단량체로 아크릴아미드와 알릴아민을 사용하였다. 다양한 조성의 공중합체를 제조하여 코팅성, 용해도, 열적 특성, 산화방지 특성 등의 유기솔더 보존제로서의 특성을 평가하였다. 공중합체중 알릴아민을 함유한 공중합체의 경우 전반적으로 Cu pad에 대해 뛰어난 코팅능과 열적안정성을 보였고, 분자량 및 알릴아민 함유량에 따라 그 특성이 변화하였다. Oxygen induced temperature를 측정하여 시간에 따른 열 안정성을 확인해 본 결과 $230^{\circ}C$까지는 70분이상 동안 아무런 산화반응에 의한 열량 변화를 관찰할 수 없었고, 모든 알릴아민계 공증합체가 산소조건하에서 $200^{\circ}C$에서 1시간 동안 무게감량의 변화가 거의 없었으므로 충분한 열적 안정성을 갖고 있는 것으로 확인되었다.

Poly(4-vinyl pyridine) (PVP) and its copolymers, poly(4-vinyl pvridine- co-acrylamide) and poly(4-vinyl pyridine-co-allylamine), were synthesized and evaluated for application to organic solder-ability preservatives (OSP). The copolymers were synthesized by radical polymerization of vinyl pyridine in the presence of acrylamide or allylamine as a comonomer. Various kinds of polymers with different chemical composition were synthesized by varying the feed ratio of monomers and their low $M_w$ polymers can be obtained by adding 2-mercaptoethanol as a chain transfer agent during poly-merization. All the polymers showed good adhesion properties on Cu pad when they were spin-coated. Especially, allylamine -containing copolymers showed both good adhesion and solubility properties. Also, they exhibited better thermal stability than PVP homopolymer and such thermal properties were changed depending on the chemical composition and their $M_w$, which were evidenced by the measurement of oxygen induced temperature (OIT). From the OIT measurement, poly(4-vinyl pyridine- co-allylamine) was thermally stable up to $230^{\circ}C$ for 70 min in the 100% oxygen environment. As a result, allylamine-containing copolymers can be considered as a promising OSP coating material that has excellent thermal and adhesive properties applicable to the present microelectronic package processes.

키워드

참고문헌

  1. R. Tummala, E. J. Ryrnaszewski, and A. G. Klopfenstein, Microelectronic Packaging Handbook, International Thompson Publishing, Vol. 2, 2nd Edition, New York, 1997
  2. R. Tummala, Advancing Microelectronics. 26,29 (1999)
  3. T. Y. Tee, J. Luan, E. Pek, C. T. Limb, and Z. Zhong, 2004 Electronic Components and Technology Conference, 1088 (2004)
  4. X. Zhang and T. Y. Tee, 2004 Electronic Components and Technology Conference, 593 (2004)
  5. T. Yan Tee, H. S. Ng, C. T. Lini, E. Pck, and Z. Zhong, 2003 Electronic Components and Technology Conference, 121 (2004)
  6. V. Denis and C. Gilles, Electronic Manufacturing Technology Symposium, 18th IEEE/CMPT International, 101 (1995)
  7. Y. Watanabe, 2001 International Symposium on Advanced Packaging Materials, 165 (2001)
  8. D.- J. Lee and H.-S. Lee, Microelectronics Reliability, 46, 1119 (2006) https://doi.org/10.1016/j.microrel.2005.08.006
  9. D. Chang, F. Bai, Y. P. Wang, and C. S. Hsiao, 2004 Electronics Packaging Technology Conference, 149 (2004)
  10. S. Malynych, I. Luzinov, and G. Chumanov, J. Phys. Chem. E, 106, 1280 (2002) https://doi.org/10.1021/jp013236d
  11. S.-K Lee, J.-K Lee, K.-M. Koo, I.-R. Jean, and W.-S. Kim, Polymer(Korea), 24, 252 (2000)