Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 4 Serial No. 37
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- Pages.281-287
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
In-situ Observation of Electromigration Behaviors of Eutectic SnPb Line
공정조성 SnPb 솔더에 대한 실시간 Electromigration 거동 관찰
- Kim Oh-Han (School of Materials Science and Engineering, Andong National University) ;
- Yoon Min-Seung (School of Materials Science and Engineering, Seoul National University) ;
- Joo Young-Chang (School of Materials Science and Engineering, Seoul National University) ;
- Park Young-Bae (School of Materials Science and Engineering, Andong National University)
- Published : 2005.12.01
Abstract
in-situ electromigration test was carried out for edge drift lines of eutectic SnPb solder using Scanning Electron Microscopy (SEM). The electromigration test for the eutectic SnPb solder sample was conducted at temperature of
공정조성의 SnPb 솔더 선형시편에서 electromigration 현상을 실시간 주사전자현미경을 이용하여 관찰하였다. 공정조성 SnPb 솔더시편에 대한 electronigration 실험은
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