References
- W. C. Gau, T. C. Chang, Y. S. Lin, J. C. Hu, L. J. Chen, C. Y. Chang, and C. L. Cheng, 'Copper electroplating for future ultralarge scale integration interconnection', J. Vac. Sci. Technol. A, Vol. 18, Iss. 2, p. 656, 2000
- C. H. Ting, D. Papapanayiotou, and M. Zhu, 'Electro-chemical deposition technology for ULSI multilevel copper interconnects', 1998 5th International Conference on Solid-State and Integrated Circuit Technology Proceedings, Beijing, China, p. 198, 1998
- M. Tsujimura, K. Mishima, J. Kunisawa, N. Makino, T. Matsuda, H. Kaneko, and K. Okumura, 'A novel compact ECD tool for ULSI Cu metallization', Proceedings of the ISSM 2000: The Ninth International Symposium on Semiconductor Manufacturing, Tokyo, Japan, p. 106, 2000
- H. Tenmei, T. Yamazaki, and Y. Narizuka, 'Study on planarizing process for high aspect ratio via-holes using for electroplating and apply to process for Cu/polyimide multilayer substrates', 2nd 1998 IEMT/IMC Symposium Proceeding, Tokyo Japan, p. 224, 1998
- J. Chen, S. Parikh, T. Vo, S. Rengarajan, T. Mandrekar, P. Ding, L. Chen, and R. Mosely, 'Barrier crystallographic texture control and its impact on copper interconnect reliability', Proceedings of the IEEE 2002 International Interconnect Technology Conference, San Francisco, CA, p. 185, 2002
- N. H. Kim, J. H. Lim, S. Y. Kim, and E. G. Chang, 'Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP', Materials Letters, Vol. 57, No. 29, p. 4601, 2003
- N. H. Kim, J. H. Lim, S. Y. Kim, and E. G. Chang, 'Semi-abrasive free slurry with acid colloidal silica for copper chemical mechanical planarization', Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 9, p. 629, 2005
- S. Y. Kim, N. H. Kim, I. P. Kim, E. G. Chang, Y. J. Seo, and H. S. Chung, 'A study on the corrosion effects by addition of complexing agent in the copper CMP process', Trans. EEM, Vol. 4, No.6, p. 28, 2003
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