Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 1 Serial No. 34
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- Pages.87-93
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Interfacial Reaction and Shear Energy of Sn-52In Solder on Ti/Cu/Au UBM with Variation of Au Thickness and Reflow Temperature
Ti/Cu/Au UBM의 Au 두께와 리플로우 온도에 따른 Sn-52In 솔더와의 계면반응 및 전단 에너지
- Choi Jae-Hoon (Department of Materials Science and Engineering, Hongik University) ;
- Jun Sung-Woo (Department of Materials Science and Engineering, Hongik University) ;
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Oh Tae-Sung
(Department of Materials Science and Engineering, Hongik University)
- Published : 2005.03.01
Abstract
Interfacial reactions between 48Sn-52In solder and
Au 층의 두께를