New High-Frequency Equivalent Circuit Model for QFP Package

QFP 패키지의 새로운 고주파 등가 회로 모델

  • 김성종 (중앙대학교 전자전기공학부) ;
  • 송상헌 (중앙대학교 전자전기공학부)
  • Published : 2005.07.01

Abstract

We present a new high-frequency equivalent circuit model for 52pin QFP used in typical IC's and extract R, L, and C values of this circuit model using a 3-D E & M field simulator. Futhermore, L and C value variations as a function of Pin number due to the shape differences of the leads have been fitted to 2nd order polynomials in order to extend the applicability of this model.

Keywords

References

  1. K. H. Kim, H. J. Chung, S. H. Yoon, S. W. Hwang, J. W. Park, S. W. Kim, J. H. Choi, and D. Ahn, 'Full Software Analysis and Impedance Matching of Radio Frequency CMOS Integrated Circuits,' IEEE Trans. on Components and Packaging Tech., Vol. 23, no. 1, pp. 183-186, March 2000 https://doi.org/10.1109/6144.833059
  2. Dean L. Monthei, 'Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications,' Kluwer Academic Publishers, pp. 43-120, 1999
  3. Luc Martens, 'High-frequency Characterization of Electronic Packaging,' Kluwer Academic Publishers, 1999