참고문헌
- J. Akagi , Y.Kuriyama, M.Asaka, T. Sugiyama, N. Iizuka, K.Tsuda and M.Obara,'Five AIGaAs/GaAs HBT IC's for a 20 Gb/s optical repeater,' IEEE ISSC Conf., pp.168, 1994 https://doi.org/10.1109/ISSCC.1994.344684
- N.Nagano, T.Suzaki, M.Soda, K.Kasahara and K.Honjo, 'AIGaAs/GaAs hetero-junction bipolar transistor IC's for optical transmission system,' IEICE Tr. Electron, vol, E76-C, No.6, pp.883, 1993
- Bongsin Kwark, Dong Sung Ma, Hwachang Seo; Kisung Ha and Moon Soo Park,' Low-cost AIGaAs/GaAs HBT multi-gigabit limiting amplifier packaged with a new plastic air tight cavity encapsulation process,' IEEE Tr. on Components, Packaging, and Manufacturing Technology, Part B:Advanced Packaging, vol. 21, pp. 309, 1998 https://doi.org/10.1109/96.704943
- T.W.Lee, Y.S.Kim, C.W.Kim, M.P.Park, and S.H. Park,'10Gbps limiting amplifier design and fabrication with AlGaAs/GaAsHBTs,' The 4th Korean Conference on Semiconductor, pp.119, 1997
- J. H. Lee, H. T. Choi, C. W. Lee, H. S. Yoon, B.S.Park and C.S. Park, ' Low-Noise AIGaAs/lnGaAs/GaAs Pseudomorphic High Electron Mobility Transistor Recessed by Electron Cyclotron Resonance Plasma Etching,' J. of the KPS, Vol.34, no. 2, pp.150,1999
- H. S. Yoon, J. H. Lee, B. S. Park, C. E. Yun, 'Fabrication and Characteristics of Extremely Low-Noise AIGaAs/lnGaAs/GaAs Pseudomorphic HEMTs,' J. of the KPS. Vol.33, no. 6, pp.741, 1998
- D .M. Kim,' Electrical Characteristics of Npn-AIGaAs/GaAs HBTs with Modulated Base Doping Structures,' J. of the KPS, Vol.33, no. 5, pp.607, 1998
- H. Kusamitsu, Y. Morishita, K. Maruhashi M.Ito and K.Ohata,' The flip chip bump interconnection for millimeter wave GaAs MMlC,' IEEE Tr. Electronics packaging Manufacturing, vol. 22, no.1, pp.23, 1999 https://doi.org/10.1109/6104.755086
- T. Hirose, K. Makiyama, K. Ono, Shimura, M. T. S.Aoki, Y. Ohashi, S. Yokokawa, Y. Watanabe, 'A flip-chip MMIC design with coplanar waveguide transmission line in the W-band', IEEE Tr. Microwave Theory and Techniques, Vol. 46, no. 2, pp. 2276 - 2282, 1998 https://doi.org/10.1109/22.739211
- A. Jentzsch, W.Heinrich, 'Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz', IEEE Tr. Microwave Theory and Techniques, Vol. 49, no. 5, pp. 871-878, 2001 https://doi.org/10.1109/22.920143
- K.Ohata, 'Millimeter-wave monolithic GaAs IC interconnect and packaging technology trends in Japan', Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, pp.105 - 108, 1999 https://doi.org/10.1109/GAAS.1999.803737
- Junwoo Lee, Baekkyu Choi, Seungyoung Ahn, Woonghwan Ryu, Jae Myun Kim, Kwang Seong Choi, Joon-Ki Hong, Heung-Sup Chun, Joungho Kim,' Microwave frequency model of wafer level package and increased loading effect on Rambus memory module', 51st Electronic Components and Technology Conference, pp.128 - 132, 2001 https://doi.org/10.1109/ECTC.2001.927707
- Y.S.Kim, S.J.Kang, K.Y.Na, S.H.Park, T.W.Lee, M.P.Park and P.E.Pyun,'Desigh and fabrication of 10 Gbps limiting amplifier using an AIGaAs/GaAs HBT,' J. of the KITE, vol 34-D, no 1, pp.14, 1997