JSTS:Journal of Semiconductor Technology and Science

The Institute of Electronics and Information Engineers (대한전자공학회)
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A System-in-Package (SiP) Integration of a 62GHz Transmitter for MM-wave Communication Terminals Applications

  • Lee, Young-Chul (School of Engineering, Information and Communications University(ICU)) ;
  • Park, Chul-Soon (School of Engineering, Information and Communications University(ICU))
  • Published : 2004.09.30
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Abstract

We demonstrate a $2.1\;{\times}\;1.0\;{\times}\;0.1cm^3$ sized compact transmitter using LTCC System-in-Package (SiP) technology for 60GHz-band wireless communication applications. For low-attenuation characteristics and resonance suppression of the SiP, we have proposed and demonstrated a coplanar double wire-bond transition and novel CPW-to-stripline transition integrating air-cavities as well as novel air-cavities embedded CPW line. The fabricated transmitter achieves an output of 13dBm at a RF frequency of 62GHz, an IF frequency of 2.4GHz, and a LO frequency of 59.6GHz. The up-conversion gain is 11dB, while the LO signal is suppressed with the image rejection mixer below -21.4dBc, and the image and spurious signals are also suppressed below -31dBc.

Keywords

References

  1. Hiroyo Ogawa, 'Millimeter-wave Wireless Access Systems', Proceeding of Asia Pacific Microwave Conference (APMC), pp.487-491, 2001 https://doi.org/10.1109/APMC.2001.985419
  2. R P Braun et al , 'Optical Millimeter-wave Systems for Broadband Mobile Commuications, Devices and Techniques', Proceedings of 1998 International Zurich Seminar on Broadband Commnications Accessing, Transmission, Networking, pp 51-58, 1998 https://doi.org/10.1109/IZSBC.1998.670244
  3. Rao R Tummala et al , 'System on Chip or System on Package?', IEEE Design & Test of Components, April-June, pp 48-56, 1999 https://doi.org/10.1109/54.765203
  4. Christer Svensson et al , 'System-in-a Package Solution for Short-Range Wireless Communications' Applied Microwave & Wireless, December, pp 78-82, 2001
  5. S Donnay et al , 'Chip-package Co-design of a 5GHz RF Front-end'. Proceedings of the IEEE. Vol 88, No 10, pp 1583-1597, 2000 https://doi.org/10.1109/5.888997
  6. Charles Q Scrantom. 'LTCC Technology Where We Are and Where We're Going- II'. 1999 IEEE MTT-S Symposium on Technologies for WIreless Applications Dig, pp 193-200, 1999 https://doi.org/10.1109/MTTTWA.1999.755161
  7. T Krems et al , 'Millimeter-wave Performance of Chip Interconnections Using Wire Bonding and Flip Chip', IEEE MTT-S Int Microwave Symposium Digest, pp 247-250, 1996 https://doi.org/10.1109/MWSYM.1996.508504
  8. G Baumann et al , '51 GHz Frontend With Flip Chip and Wire Bond Interconnections from GaAs MMICs to a Planar Patch Antenna', IEEE MTT-S Int Microwave Symposium Digest, Vol 3, pp 1639-1642, 1995 https://doi.org/10.1109/MWSYM.1995.406291
  9. Sang-Ki Yun et al , 'Parasitic Impedance Analysis of Double Bonding Wires for High-Frequency Integrated Circuit Packaging', IEEE Microwave and Guided Wave Letters, Vol 5, No 9, pp 296-298, 1995 https://doi.org/10.1109/75.410403
  10. F J Schmuckle et al , 'LTCC as MCM Substrate Design of Strip-Line Structures and Flip-Chip Interconnections', IEEE MTT-S Int Microwave Symposium Digest, Vol 3, pp 1093-1096, 2001 https://doi.org/10.1109/MWSYM.2001.967280
  11. Young Chul Lee and Chul Soon Park, 'A Novel High-Q LTCC Stripline Resonator for Millimeter-Wave Applications', IEEE Microwave and Wireless Components Letters, Vol 13, No 12, pp 499-504, 2003 https://doi.org/10.1109/LMWC.2003.819960
  12. Young Chul Lee and Chul Soon Park, 'Loss Minimization of LTCC Microstrip Structure With Air-Cavities Embedment in the Dielectric', Int J Electron Commun (AEU), Vol 57, No 6, pp 429-432, 2003 https://doi.org/10.1078/1434-8411-54100198
  13. William H Haydl, 'On the Use of Vias in Conductor-Backed Coplanar Circuits', IEEE Trans on Microwave Theory and Techniques, Vol.50, No 6, pp 1571-1577, 2002 https://doi.org/10.1109/TMTT.2002.1006419
  14. Nirod K Das, 'Methods of Suppression or Avoidance of Parallel-Plate Power Leakage from Conductor-Backed Transmission Lines', IEEE Trans on Microwave Theory and Techniques, Vol 44, No 2, pp 169-181, 1996 https://doi.org/10.1109/22.481565
  15. David M Pozar, 'Microwave Engineering', John Wilet & Sons, 1998
  16. I J Bahl et al, 'Microstrip Antennas', Artech House, 1982
  17. T Krems et al , 'Avoiding Cross Talk and Feedback effects in Packaging Coplanar Millimeter-wave Circuits', IEEE MTT-S Int Microwave Symposium Digest, Vol 3, pp 1091-1094, 1998 https://doi.org/10.1109/MWSYM.1998.705183
  18. Robert W Jackson, 'Mode Conversion at Discontinuties in Finite-Width Conductor-Backed Coplanar Waveguide', IEEE Trans on Microwave Theory and Techrnques, Vol 37, No 10, pp 1582-1589, 1989 https://doi.org/10.1109/22.41005
  19. K Beilenhoff et al , 'Excitation of the Parasitic Parallel-Plate Line Mode at Coplanar Discontinuities', IEEE MIT-S Int Microwave Symposium Dlgest, Vol 3, pp 1789-1792, 1997 https://doi.org/10.1109/MWSYM.1997.596891