마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제11권2호
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- Pages.53-58
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- 2004
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
63Sn-37Pb 솔더 스트립에서의 Electromigration 거동
Electromigration Behavior in the 63Sn-37Pb Solder Strip
- Lim Seung-Hyun (Department of Materials Science and Engineering, Hongik University) ;
- Choi Jae-Hoon (Department of Materials Science and Engineering, Hongik University) ;
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Oh Tae-Sung
(Department of Materials Science and Engineering, Hongik University)
- 발행 : 2004.06.01
초록
63Sn-37Pb 공정솔더의 electromigration 현상을 용이하게 관찰하기 위해 63Sn-37Pb 공정솔 더를 증착하여 스트립 형태의 시편을 제작 후 electromigration 테스트를 실시하였다.
To facilitate the observation of the electromigration of 63Sn-37Pb eutectic solder, strip-type samples were fabricated by solder evaporation. The electromigration test for the 63Sn-37Pb solder strip was conducted at temperatures of