Effect of Gradient Plasma Power on TiN, TiCN Coating Deposited by PECVD Process

PECVD법에 의한 TiN, TiCN 증착 시 gradient plasma power가 코팅층에 미치는 영향

  • Kim, D.J. (R&D Center, Dongwoo Heat Treating Co., LTD.) ;
  • Shin, C.H. (R&D Center, Dongwoo Heat Treating Co., LTD.) ;
  • Hur, J. (R&D Center, Dongwoo Heat Treating Co., LTD.) ;
  • Nam, T.W. (Dept. of Materials Sci. & Eng. Hanyang University)
  • 김동진 (동우열처리공업(주) 기술연구소) ;
  • 신창현 (동우열처리공업(주) 기술연구소) ;
  • 허정 (동우열처리공업(주) 기술연구소) ;
  • 남태운 (한양대학교 금속재료공학과)
  • Received : 2004.05.10
  • Accepted : 2004.07.12
  • Published : 2004.07.30

Abstract

Effect of plasma power on PECVD process were investigated in this study. TiN and TiCN films were deposited on nitrided STD11 steel with 600W, 1,200W and 1,600W plasma power. As the plasma power was increased, the preferred orientation was reinforced from (200) to (111) and the hardness of films was improved. The low plasma power was, however, effective for improving of adhesion force of films. Regarding above properties, TiN and TiCN films were deposited by gradient plasma power. It was possible to get high hardness as well as adhesion force through gradient plasma power.

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