Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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The Effect of Complexing Agent on the Deposit Charateristics in the Electroless Nickel Plating Solution

무전해 니켈 도금액에서 착화제가 도금피막에 미치는 영향

  • Published : 2004.12.01
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Abstract

Deposit charateristics of Electroless nickel(EN) were investigated with various complexing agents. As expected, the deposition rate of nickel is increased with pH and that of Phosphorous is decreased with pH. The result of SEM investigation shows that the rough surface crystallization is appeared with pH. It is show that the surface resistance of EN deposit is decreased with pH at 85$^{\circ}C$.

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References

  1. W. J. Cheong, Ben L. Luan, David W. Shoesmith, Applied Surface Science, 229 (2004) 282-300 https://doi.org/10.1016/j.apsusc.2004.02.003
  2. C. R. Shipley Jr, Plat. Surf. Finish, 71(6) (1984) 92-99
  3. H. Keping, J. L. Fang, Metal Finishing, (1997) 73-75
  4. J. Hur, J. H. Lee, J. Corros. Soc. of Korea, 29 (2000) 46-54
  5. K. L. Lin, J. W. Hang, Materials Chemistry and Physics, 76 (2002) 204-211 https://doi.org/10.1016/S0254-0584(01)00516-8
  6. N. M. Martyak, Plating & Finishing, (2003) 46-51
  7. G. O. Mallory, J. B. Hajudu, American Electroplaters & Surf. Fin. Soc. (1996)
  8. J. Colaruotolo, D. Tramontana, Electroless Plating (1990) 207-209
  9. G. O. Malloy, Electroless Plating, (1990) 57-99
  10. B. K. Min, J S. Yoo, S. D. Choi, H. J. Shin, Kor. Inst. Surf. Eng. 32(4) (1999) 487-495
  11. S. W. Hur, Electroless Plating Technical, (2002) 11-12