Coupling Performance Analysis of a Buried Meshed-Ground in a Multi-layered Structure

  • 발행 : 2004.12.01

초록

Since the manufacturing process in the LTCC process does not allow solid ground planes between ceramic layers to isolate the signal lines, the buried ground should be realized as a meshed ground plane. Both characteristic impedances of the signal lines and couplings between different signal layers are influenced by the properties of these meshed planes. In this paper, we propose a new analysis method for coupling behavior between internal transmission lines, which are isolated by the buried meshed-ground planes. The coupling behavior between layers isolated by meshed-ground planes is investigated by the coupled-transmission line model for the isolated layers. The coupling factors between isolated lines with the meshed-ground are extracted by 2-D FEM calculations.

키워드

참고문헌

  1. H. Thust et al, 'Coupling behavior between transmission lines with meshed ground planes in LTCC-MCMs,' Microwave Journal, vol.41, no.11, pp.70-79, Nov. 1998
  2. David M. Pozar, Microwave Engineering, John Wiley & Sons, Inc, 1998
  3. R. Levy, 'A Generalized Design Technique for Practical Distributed Reciprocal Ladder Network,' IEEE Trans. Microwave Theory tech., vol. MTT-21, no.8, pp519-526, Aug. 1973
  4. R. Levy, 'Tapered corrugated waveguide low-pass filter,' IEEE Transaction on. Microwave Theory and tech. vol. MTT-21, no.8, pp526-532, Aug. 1973