International Journal of Korean Welding Society

The Korean Welding and Joining Society (대한용접접합학회)
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Thermal Fatigue Life of Underfilled $\mu\textrm$ BGA Solder Joint

  • Kim, H.H. (GM-Deawoo Motors) ;
  • Han, S.W. (Department of Mechanical Engineering, Chung-Ang University) ;
  • Kim, H.I. (Department of Mechanical Engineering, Chung-Ang University) ;
  • Choi, M. (Department of Mechanical Engineering, Chung-Ang University) ;
  • Shin, Y.E. (Department of Mechanical Engineering, Chung-Ang University)
  • Published : 2004.06.01
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Abstract

In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

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