참고문헌
- IEEE Trans. on Components & Packaing Technologics v.23 no.2 Advanced flip chip bonding techniques using transferred microsolder bumps N.Koshoubu;S.Ishizawa;H.Tsunetsugu;H.Takahara https://doi.org/10.1109/6144.846781
- 전기전자재료학회논문지 v.14 no.11 플립칩용 웨이퍼레벨 Fine pitch 솔더버프 형성 주철원;김성진;백규하;이희태;한병성;박성수;강영일
- Fundamentals of Microsystems Packaging R.Tummala
- 전기전자재료학회논문지 v.16 no.1 공정 조서의 SnPb솔더에서의 Electromigration 거동 최재영;이상수;주영창
- Materials Science and Engineering R: Reports v.34 no.1 Tin-lead (SnBb) solder reaction in flip chip technology K.N.Tu;K.Zeng https://doi.org/10.1016/S0927-796X(01)00029-8
- Mater. Trans. v.43 no.8 Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5Ag-0.75Cu solder C.B.Lee;S.B.Jung;Y.E.Shin;C.C.Shur https://doi.org/10.2320/matertrans.43.1858
- 전기전자재료학회논문지 v.16 no.6 P의 함량에 따른 Su-Ag-Cu 및 Sn-Cu 무연솔더의 특성평가 신영의;황성진
- IEEE Trans. on components & Packaging Technologies v.24 no.4 Thermal cycling analysis of flip-chip solder joint reliability Pang JHL;Chong DYR;Low TH https://doi.org/10.1109/6144.974964
- 2001 Electronic Components and Technology Conference Proceedings, 51st Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation B.Salam;N.N.Ekere;D.Rajkumar
- J. Electr. Mater. v.31 no.8 The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages M.T.Sheena;C.M.Changa https://doi.org/10.1007/s11664-002-0201-9