A Study on the Application of Thermoelectric Module to the Electric Telecommunication Equipment Cooling

열전소자를 이용한 전자 통신장비 냉각에 관한 연구

  • Received : 2004.08.02
  • Accepted : 2004.11.10
  • Published : 2004.12.31

Abstract

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

Keywords

References

  1. 김원태, 'ISDN 정보통신 시스템에서의 열관리 및 전자부품실장 냉각기술,' 대한기계학회지, Vol.36, No, 4, pp.351-364, ISSN 1225-5955, 1996
  2. 강병하., 장혁재, 김서영, 김석현, '열전 모듈을 이용한 에어컨의 발열부의 냉각특성에 관한 연구', 설비공학 논문집, Vol .14, No.3, pp.214-220, 2002
  3. 노승탁, 서정세, 열전냉동의 원리와 열전냉동 시스템의 설계, 공기조화냉동공학, Vol.19, No.3 pp.135-145, 1990
  4. 유성연, 홍정표, 심우섭, 열전소자 및 열전 냉각 장치의 성능에 관한 연구, 설비공학 논문집., Vol. 16, No.1, pp.62-69, 2004
  5. Goldsmid, H. J., Electronic Refrigeration, London Pion, pp.1-16, 1989
  6. Solomon, M., Determination of Thermo electric Module Parameters, 18th Int. Conference on Thermoelectrics, pp. 519- 524, 1998
  7. Nolas, G. S., Sharp, J. and Goldsmid, H. J., 'Thermoelectrics Basic Principles and New Materials Developments', Berlin New York Springer, pp.1-5, 2001
  8. Haruo U., Yasuyuki I. and Nobutake S., Study of Thermoelectric Dehumi difier, The Japan Society of Mechanical Engineers, No. 97-25 pp.132-135, 1997
  9. Hong, X., Wendy L. and Kelvin H., Thermal Solution to Pentium Processors in TCP in Notebooks and Sub-Notebooks, IEEE Transactions on Component Pack aging and Manufacturing Technology : Part-A, Vol. 19, No.1, pp.208-218, 1996
  10. Huang, B. J., Chin, C. J. and Duang, C. L., A Design Method of Thermo electric Cooler, International J. Refrige ration,Vol. 23, pp.208-218, 2000 https://doi.org/10.1016/S0140-7007(99)00046-8
  11. Angrist, S.W., Direct Energy Conve- rsion, Allyn and Bacon, Inc., 2nd edition, Boston. pp.15-38, 1970
  12. Miner A., Majumdar A., Thermo- Electro Mechanical Refrigeration Based on Transient Thermoelectric Effects, Proceedings of the 18th International Conference on Thermo- Electrics, pp.27-30, 1999