Journal of the Korean Wood Science and Technology

The Korean Society of Wood Science & Technology (한국목재공학회)
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Resin Impregnation of Sawdust Board for Making Woodceramics(II) - Effect of Density and Addition Rate of Phenol Formaldehyde Resin -

우드세라믹 제조용 톱밥보드의 수지함침(II) - 밀도 및 페놀수지 첨가량의 영향 -

  • Oh, Seung Won (College of Agriculture & Life Science, Research Institute of Bioindustry, Chonbuk National University) ;
  • Byeon, Hee Seop (College of Agriculture & Life Science, Institute of Agriculture & Life Science, Gyeongsang National University)
  • 오승원 (전북대학교 농업생명과학대학, 생물산업연구소) ;
  • 변희섭 (경상대학교 농업생명과학대학, 농업생명과학연구원)
  • Received : 2002.11.11
  • Accepted : 2002.12.05
  • Published : 2003.10.26
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Abstract

This study was carried out to investigate the properties of sawdust board impregnated with phenol resin according to the density and resin content of board. The sawdust board were manufactured to target densities of 0.4, 0.5, 0.6, 0.7 g/cm3 and resin content of 5, 10, 15, 20% made from Pinus densiflora S. et Z., Larix. kaemferi C. and Pinus koraiensis S. et Z. The impregnation process were executed in two ways, the application of vacuum pressure then followed by atmospheric pressure, and the application of vacuum pressure with ultrasonic vibration then followed by atmospheric pressure. The density of impregnated sawdust board increased as density and resin content of sawdust board increased, but impregnation rate decreased. The density, impregnation rate, bending strength and brinell hardness of sawdust board in impregnated vacuum pressure with ultrasonic vibration then nonpressure were higher than those of vacuum pressure then nonpressure. In this results, the impregnation rate is increased in vacuum pressure with ultrasonic vibration then nonpressure, it has affected the properties of sawdust board impregnated with phenol resin.

국산 간벌재 3수종을 이용하여 밀도 및 수지첨가량을 달리해서 톱밥보드를 제조한 후 감압 후 상압, 감압·초음파 병행 후 상압으로 20분씩 3반복 함침하여 밀도 및 수지첨가량에 따른 함침 보드의 물성을 측정하고, 함침 시 초음파처리 효과를 조사하였다. 밀도 및 수지첨가량이 증가함에 따라 함침 보드의 밀도, 휨강도 및 브리넬 경도는 증가하였으나, 수지 함침율은 감소하였다. 감압·초음파 병행 후 상압 함침에 의한 함침보드의 밀도, 수지함침율, 휨강도 및 브리넬 경도가 감압 후 상압에 의한 함침 보드 보다 컸다. 보드 함침 시 초음파처리를 병행함으로써 수지 함침율이 증가되어 함침 보드의 물성에 영향을 미치는 것으로 판단된다.

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