Journal of computational fluids engineering (한국전산유체공학회지)

Korean Society of Computational Fluids Engineering (한국전산유체공학회)
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A Numerical Model to Analyze Thermal Behavior of a Radiative Heater Disigned for Flip-Chip Bonders

플립칩 본더용 가열기의 열특성 해석을 위한 수치모델

  • 이상현 (금오공과대학교 대학원 기계공학과) ;
  • 곽호상 (금오공과대학교 기계공학부) ;
  • 한창수 (기계연구원) ;
  • 류도현 ((주)탑엔지니어링 기술연구소)
  • Published : 2003.12.01
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Abstract

This study presents a numerical model to analyze dynamic thermal behavior of a hot chuck designed for flip-chip bonders. The hot chuck of concern is a heater which has been specifically developed for accomplishing high-speed and ultra-precision soldering. The characteristic features are radiative heat source and the heating tool made of a material of high thermal diffusivity. A physical modeling has been conducted for the network of heat transport. A simplified finite volume model is deviced to simulate time-dependent thermal behavior of the heating tool on which soldering is achieved. The reliability of the proposed numerical model is verified experimentally. A series of numerical tests illustrate the usefulness of the numerical model in design analysis.

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References

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