Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지

Corrosion Protection of Plasma-Polymerized Cyclohexane Films Deposited on Copper

  • Park, Z.T. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Lee, J.H. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Choi, Y.S. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Ahn, S.H. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Kim, J.G. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Cho, S.H. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Boo, J.H.
  • Published : 2003.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

The corrosion failure of electronic devices has been a major reliability concern lately. This failure is an ongoing concern because of miniaturization of integrated circuits (IC) and the increased use of polymers in electronic packaging. Recently, plasma-polymerized cyclohexane films were considered as a possible candidate for a interlayer dielectric for multilever metallization of ultra large scale integrated (ULSI) semiconductor devices. In this paper the protective ability of above films as a function of deposition temperature and RF power in an 3.5 wt.% NaCl solution were examined by polarization measurement. The film was characterized by FTIR spectroscopy and contact angle measurement. The protective efficiency of the film increased with increasing deposition temperature and RF power, which induced the higher degree of cross-linking and hydrophobicity of the films.

Keywords

References

  1. S. P. Murarka, Materials Science, Engineering, R19 (1997) 87
  2. W. W. Lee, P. S. Ho, MRS Bulletin, 22 (1997) 19 https://doi.org/10.1557/S0883769400033352
  3. T. Homma, Thin Solid Films, 278 (1996) 28 https://doi.org/10.1016/0040-6090(95)08116-X
  4. S. P. Murarka, I. V. Verner, R. J. Gutmann Copper-Fundamental Mechanisms for Microelectronic Applications, John Wiley & Sons, INC. (2000) 22
  5. A. Kohn, M. Eizenberg, Y. Shacham-Diamand, Y. Sverdlov, Materials Science and Engineering, A302 (2001) 18
  6. J. S. Jeon, D. H. Jeon, Journal of Corrosion Science Society of Korea, 19 (1990) 33
  7. H. P. Lee, Ken Nobe, Journal of Electro chemical society, 133 (1986) 2035 https://doi.org/10.1149/1.2108335
  8. A. V. Benedetti, P. T. A. Sumodjo, K. Nobe P. L. Cabot and W. G. Proud, ElectrochimicaActa, 40 (1995) 2657 https://doi.org/10.1016/0013-4686(95)00108-Q
  9. D. Taneichi, R. Haneda, K. Aramaki, Corrosion Science, 43 (2001) 1589 https://doi.org/10.1016/S0010-938X(00)00152-9
  10. K. Nozawa, K. Aramaki, Corrosion Science, 41 (1999) 57 https://doi.org/10.1016/S0010-938X(98)00048-1