Ni-Fe-P 합금전착에 미치는 Grain Refiner의 영향

The Effect of Grain Refiner on Ni-Fe-P Alloy Electrodeposition

  • 서무홍 (한국원자력연구소 원자력재료기술개발부) ;
  • 김동진 (한국원자력연구소 원자력재료기술개발부) ;
  • 김정수 (한국원자력연구소 원자력재료기술개발부)
  • 발행 : 2003.12.01

초록

The effects of additive(grain refiner, GR) on process efficiency of the Ni-Fe-P alloy electrodeposition and the material properties of the deposit were investigated. Electrochemical properties of the deposits were investigated using polarization and electrochemical impedance techniques, and the material properties of the deposits were characterized through inductively coupled plasma(ICP), spiral contractometer, XRD, SEM and TEM. When the additive was added into the electrodeposition bath, current efficiency, Ni content and corrosion resistance of the deposit increased, whereas residual stress, surface roughness and grain size of the deposit decreased.

키워드

참고문헌

  1. J. S. Lee, S. T. Oh, J. H. You, Bulletin of Korean Ins. Met. & Mat., 14, 7 (2001) 24-34.
  2. K. Sridharan, K. Sheppard, J. Applied Electrochemistry, 29 (1997) 1198-1206
  3. M. Pushpavanm, Bulletin of EIectrochemistry 15,5-6 (1999) 211-214.
  4. J. S. Kim, Repair technique of steam generatortubes using electroforming, Report No. KAERI/AR-601/2001, (2001) 27
  5. L. Oniciu, L. Muresan, J. Applied Electrochemistry,21 (1991) 565 https://doi.org/10.1007/BF01024843
  6. B. C. Baker, A. C. West, J. Electrochem. Soc.,144, 1 (1997) 164 https://doi.org/10.1149/1.1837379
  7. T. C. Franklin, Surf. Coat. Tech., 30 (1987) 415 https://doi.org/10.1016/0257-8972(87)90133-2
  8. H. T. Kim, Effect of additives on the eiectrocrystalli-zation of Zn, Zn-Ni alloy electrodeposition fromchloride-based electrolyte, (1998) 62
  9. J. P. Bonino, P. Pouderous, C. Rossignol, A. Rousset,Plating & Surface Finishing, (1992) 62
  10. E. Raub, N. Baba, M. Stabyer, Advance Copy(E15),6th Intemat. Metal Finishing Conference, London,(1964) 96
  11. M. Paunovic, M. Schlesinger, Fundamentals ofelectrochemical deposition, Wiley, New York, (1998) 167
  12. N. Kaneko, N. Shinohara, H. Nezum Electrochim.Acta 38, 10 (1993) 1351 https://doi.org/10.1016/0013-4686(93)80069-C
  13. J. H. Lee, Bul. Kor. Inst. Met. & Mater., 12, 6(1999) 658-666
  14. E. Grunwald : Procedee modeme de protectie asuprafetelor, MICHODPT, Bucuresti, (1969)
  15. K. J. Vetter, F. Gom, Electrochim. Acta 18 (1973)321 https://doi.org/10.1016/0013-4686(73)80036-2
  16. C. Cheung, F. Djunada, U. Erb, G. Palumbo, Nanostructured Materials 5, 5 (1995) 513 https://doi.org/10.1016/0965-9773(95)00264-F