마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제10권2호
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- Pages.61-67
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- 2003
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
고집적 플립 칩용 극미세 58Bi-42Sn 솔더 범프와 Au/Ni/Ti UBM의 계면 반응
Interfacial Reaction between Ultra-Small 58Bi-42Sn Solder Bump and Au/Ni/Ti UBM for Ultra-Fine Flip Chip Application
- Kang, Woon-Byung (Div. of Materials Science & Engineering, Hanyang University) ;
- Jung, Yoon (Div. of Materials Science & Engineering, Hanyang University) ;
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Kim, Young-Ho
(Div. of Materials Science & Engineering, Hanyang University)
- 발행 : 2003.06.01
초록
고집적 플립 칩 기술을 위한
The interfacial reaction between ultra-small 58Bi-42Sn solder and Au/Ni/Ti under bump metallurgy (UBM) for ultra-fine flip chip application was investigated. The ultra-small 58Bi-42Sn solder bump, about
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