Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Sticking Characteristics in Bi2Sr2CanCun+1Ox Thin Films Fabricated by using the Evaporation Method to Improve the Sticking Ratio

부착율 개선을 위해 증발 법으로 제작한 Bi2Sr2CanCun+1Ox 박막의 부착 특성

  • 천민우 (동신대학교 전기전자공학과) ;
  • 박용필 (동신대학교 전기전자공학과)
  • Published : 2003.11.01
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Abstract

The Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{x}$, superconducting thin films arc fabricated by using the sputtering and evaporation method. Because we confirmed the sticking ratio of Bi element in the Bi$_2$Sr$_2$Ca$_{n}$Cu$_{n+1}$ O$_{x}$ superconducting thin film fabricated by using the sputtering method was much lower than the expected value, to get the enough number of the flakes of Bi, faraday cup was used to evaporate Bi clement. As a result of the fabrication, Bi 2201 and Bi 2212 single phases could be made by the optima of deposition condition. And we confirmed the sticking coefficient of Bi element was clearly related to the temperature change of the substrate and the generation of Bi22l2 phase

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References

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