Annealing Effects on Ultra thin MOS Capacitors

  • Ng, Alvin Chi-hai (Dept. of Electronic Engineering, Chinese university of Hong Kong) ;
  • Xu, Jun (Dept. of Electronic Engineering, Chinese university of Hong Kong) ;
  • Xu, J.B. (Dept. of Electronic Engineering, Chinese university of Hong Kong) ;
  • Cheung, W.Y. (Dept. of Electronic Engineering, Chinese university of Hong Kong)
  • Published : 2003.09.01

Abstract

Silicon oxide with thickness lee than 9 nm is fabricated by tube furnace oxidation. Nitrogen is added to dilute the oxidation rate. Aluminum dots with radius of 0.05 cm are deposited on the oixde. High frequency capacitance-voltage(HF C-V), conductance-voltage(G-V) and current-voltage(I-V) characteristics are measured. Annealing under nitrogen atmosphere is carried out with different time and at different temperature. Densities of the interface states before and after annealing are compared. After annealing, a decrease in density of the interface states is found. Experiments show that 45$0^{\circ}C$ annealing for 30 minutes has the lowest density of the interface states.

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