Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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DBM 공정에 의한 구형 솔더볼 분말의 제조기술 연구동향

  • 송인혁 (한국기계연구원 재료연구부) ;
  • 한유동 (한국기계연구원 재료연구부) ;
  • 박환영 (한국기계연구원 재료연구부) ;
  • 최일동 (한국해양대학교 재료공학과)
  • Published : 2003.08.01
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References

  1. J. Kor. Mater. Res. v.7 no.4 Alloy Design and Evaluation of Sn-Bi-In-Zn Solder through Thermodynamic Calculation S.W.Yoon;B.J.Lee;H.M.Lee
  2. J. Kor. Mater. Res. v.9 no.9 A Study on the Microstructure and Adhesion Properties of Sn-3.5Ag/Alloy 42 Lead-Frame Solder Joint S.W.Kim;K.S.Bae
  3. J. Kor. Mater. Res. v.8 no.9 A Study on Interfacial Reaction and Mechanical Properties of 43Sn-57Bi-X Solder and Cu Subsrate Y.J.Seo;K.K.Lee;D.J.Lee
  4. J. Kor. Inst. Met. & Mater. v.8 no.11 A Study on the Characteristics of Low Pb Sn-5 wt%Pb-1.5 wt%Ag-X%In Solder Alloy S.K.Hong;C.H.Ju;C.Y.Kang;I.B.Kim
  5. Int. J. Solids and Structure v.37 A Study of the coarsening in Tin/Lead Solder W.Dreyer;W.H.Muller https://doi.org/10.1016/S0020-7683(99)00146-8
  6. M. S. Thesis A Study of Spray Forming Using Uniform Droplet Sprays C.H.Passow
  7. M. S. Thesis Thermal State of Sn-Pb Droplet in the Droplet-Based Manufacturing Process S.Sahu
  8. M. S. Thesis Characterization of Droplet Flight Path and Mass Flux in Droplet-Base Manufacturing G.K.Abel
  9. M. S. Thesis Modeling of Deposit Solidification in Droplet Based Manufacturing P.J.Acquaviva
  10. Ph. D. Thesis The Role of Surface Oxidation in the Break-Up of Laminar Liquid Metal Jets P.Yim
  11. M. S. Thesis Control of the UDS Process for the Production of Solder Balls for BGA Elecrtonics Packaging J.C.Racha
  12. Scripta Mater. v.34 no.5 Effects of Droplet Thermal State of Deposit Microstructure in Spay Forming P.J.Acquaviva;J.H.Chun;T.Ando https://doi.org/10.1016/1359-6462(95)00583-8
  13. Int. J. Heat and Fluid Flow v.20 Contribution to Droplet Break-Up Analysis P.Berthoumieu;H.Carentz;P.Villedieu;G.Lavergne https://doi.org/10.1016/S0142-727X(99)00037-5
  14. Annals of the CIRP v.42 no.1 Droplet-Based Manufacturing J.H.Chun;C.H.Passow
  15. Metallurgical Transaction A v.24A Spray Deposition of a Sn-40 wt%Pb Alloy with Uniform Droplet J.H.Chun;C.H.Passow;T.Ando
  16. SMTA's Emerging Technology Symposium Solder Jet Printing of Micropads and Vertical Interconnect D.B.Wallace;D.J.Hayes
  17. The International Journal of Microcircuits and Electronic Packaging v.27 no.1 Solder Jet Technology Update D.B.Wallace;D.J.Hayes