References
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- Feinfcous 카달로그.
- 더한금속학회, “금속공학실험". 1983. pp.252
- Ning-Cheng Lee. “Reflow soldering processes andtroubleshooting SMT. BGA. CSP and Flip chiptechnologies". 2002. pp.197.
- IPC - Association Connecting Electronics Industries.IPC-7075. ‘Design and assembly process implementationfor BGAs". 2000.
- W. O'Hara and N.C. Lee. “Voiding mechanism inBGAAssembly. ISHM. 1995