References
- Transactions of KSAE v.4 no.3 Prediction of Propagation Path for the Interface Crack in Bonded Dissimilar Materials Chung,N.Y.;Song,C.H.
- Int. J. Automotive Technology v.3 no.4 Ultrasonic Detection of Interface Crack in Adhesively Bonded DCB Joints Chung,N.Y.;Park,S.I.;Park,C.H.
- Transaction of KSME v.26 no.11 Evaluation Method of Interface Strength in Bonded Dissimilar Materials of AI/Epoxy Chung,N.Y.
- Transaction of KSME v.21 no.8 Fracture Criterion of Mixed Mode in Adhesively Bonded Joints of AI/Steel Dissimilar Materials Chung,N.Y.;Jang,J.M.
- Material v.39 no.443 fracture Criterion of Mixed Mode in Adhesively Bonded Joints N.Y.Chung;R.Yukki;H.Ishikawa;S.Nakano
- Eng. Frac. Mech. v.41 no.5 Stress Based Criteria for an Interface Crack Kinking Out of the Interface in Dissimilar Materials R.Yuuki;J.Q.Xu https://doi.org/10.1016/0013-7944(92)90150-D
- Trans. ASME;J. Appl. Mech. v.58 Biaxial Loading Experiments for Determining Interfacial Fracture Toughness K.M.Liechti;Y.S.Chai https://doi.org/10.1115/1.2897248
- An Experimental Study on Interfacial Toughness between Chip and Leadframe S.B.Lee;Y.Y.Earmme
- Transaction of KSME v.24 no.6 Analyses of Stress Intensity Factors and Evaluation of Fracture Toughness in Adhesively Bonded DCB Joints Chung,N.Y.;Lee,M.D.;Kang,S.K.
- Transaction of KSME v.25 no.6 Establishment of Fracture Criteria for Mixed Mode in Bonded Dissimilar Materials with an Crack Emanating from an Edge Semicircular Hole Chung,N.Y.;Song,C.H.
- Experimental Method of Photoelasticity Z.Tuzi;M.Nisida;K.Kawata
- Proceeding of the KSME Spring Annual Bonding Residual Stress in Bonded Joints of Dissimilar Materials Chung,N.Y.;Oh,B.T.;Song,C.H.