참고문헌
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Application of linear annealing method to Si∥
$SiO_{2}/Si$ wafer direct bonding J.W.Lee;C.S.Kang;O.S.Song;C.K.Kim - J. Appl. Phys. v.64 no.10 Bonding of silicon wafers for silicon-on-insulator W.P.Maszara;G.Goetz;A.Caviglia;J.B.McKitterick https://doi.org/10.1063/1.342443
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전기전자재료학회논문집
v.15
no.4
선형가열기를 이용한 SiⅡ
$SiO_{2}/Si_{3}N_{4}$ Ⅱ Si 이종기판쌍의 직접접합 이상현;이상돈;송오성 https://doi.org/10.4313/JKEM.2002.15.4.301 - 전기전자재료학회논문집 v.15 no.6 유리/실리콘 직접접합에서의 세정 및 열처리 효과 민홍석;주영창;송오성 https://doi.org/10.4313/JKEM.2002.15.6.479
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