참고문헌
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Journal of Materials Science
v.35
Fabrication process and thermal properties of
$SiC_p$ /AI-Si metal matrix composites for electronic packaging applications Lee, H.S.;Jeon, K.Y.;Kim, H.Y.;Hong, S.H. https://doi.org/10.1023/A:1026749831726 - Metallurgical and Materials Transactions A v.29A no.7 Dependence of Thermal Residual Stress on Temperature in a SiC Particle-Reinforced 6061AI Alloy H. Li;J. B. Li;Z. G. Wang;C. R. Chen;D. Z. Wang
- Materials Science & Engineering A v.A278 no.1-2 Finite element analysis about effects of particle morphology on mechanical response of composites Chen, C.R.;Qin, S.Y.;Li, S.X.;Wen, J.L.
- Journal of Materials Science Letter v.17 Study on temperature dependence of thermal expansion behavior of SiCw/AI composite by internal stress analysis Geng, L.;Ochiai, S.;Yao, C.K. https://doi.org/10.1023/A:1006660510785