Journal of the Institute of Electronics Engineers of Korea TC (대한전자공학회논문지TC)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Design of Silicon MEMS Package for CPW MMICs

CPW MMIC 칩 실장을 위한 실리콘 MEMS 패키지 설계

  • Kim, Jin-Yang (Department of Electronics Engineering, Ajou University) ;
  • Kim, Sung-Jin (Department of Electronics Engineering, Ajou University) ;
  • Lee, Hai-Young (Department of Electronics Engineering, Ajou University)
  • Published : 2002.11.01
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Abstract

A MEMS(Micro Electro Mechanical System) package using a doped-silicon(Si) carrier for coplanar microwave and millimeter-wave integrated circuits is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed carrier scheme is verified by fabrication and measuring a GaAs CPW(Coplanar Waveguide) on the three types of Si-carriers(gold-plated high resistivity, lightly doped, high resistivity). The proposed MEMS package using the lightly doped(15 ${\Omega}{\cdot}$) Si-carrier shows parasitic-free performance since the lossy Si-carrier effectively absorbs and suppresses the resonant leakage.

본 논문에서는 CPW MMIC 실장시 발생되는 기생 공진 현상을 제거하기 위한 새로운 구조의 실리콘 MEMS 패키지를 제안하였다. 또한 세 가지 형태의 실리콘 칩 캐리어(gold-plated high resistivity, lightly doped, high resistivity) 상에 GaAs CPW 패턴을 제작하고 해석/측정함으로써, 제안된 패키지의 성능을 확인하였다. 해석 및 측정 결과 제안된 MEMS 패키지는 비저항이(resistivity) 15 ${\Omega}{\cdot}$㎝인 실리콘 캐리어(carrier)를 사용함으로써 기생 공진 현상을 효과적으로 억제시킬 수 있었다.

Keywords

References

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