Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 9 Issue 3
- /
- Pages.1-6
- /
- 2002
- /
- 1226-9360(pISSN)
- /
- 2287-7525(eISSN)
Deposition Technology of Copper Thin Films for Multi-level Metallizations
다층배선을 위한 구리박막 형성기술
Abstract
A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between
Keywords
- Copper film;
- Multi-level interconnection;
- Precusor;
- Integrated circuit processing;
- Electrical resistivity