Mechanical Design of Deepwater Pipeline Wall Thickness Using the Recent Rules

최신 설계규정에 의한 심해 해저관로 두께의 기계적 설계

  • Han-Suk Choi (Dept. of Naval Architecture and Ocean Engineering Pusan National University)
  • Published : 2002.12.01

Abstract

This paper presents a mechanical design of the deepwater pipeline wall thickness using the recent design rules. Characteristics and limitations of the new codes were identified through a case study design in the Gulf of Mexico. In addition to the ASME, API, and DVD codes, the code of federal regulations (CFR) was also utilized in the design. It was found that conservatism still exists within the collapse prediction for water depth greater than 1500m. Comparision of the results from DNV and API codes were presented.

Keywords

References

  1. American Petroleum Institute Recommended Practice 1111 (3rd edition) Design, Construction, Operation, and Maintenance of Offshore Hydrocarbon Piplines(Limit State Design) API
  2. American Petroleum Institute Specification 5L (42nd edition) Specification for Line Pipe API
  3. American Society of Mechanical Engineer B31.4 Liquid Petroleum Transportation Piping System ASME
  4. Pipelines and Risers Bai, Y.
  5. Code of Federal Regulations, Title 30 Oil and Gas and Sulphur Operations in the Outer Continental Shelf CFR
  6. Code of Federal Regulations, Title 49 Transportation of Hazardous Liquids by Pipelines CFR
  7. Int. J. of Ocean Engieering and Technology v.1 no.1 Large Diameter Pipeline Installation in Ultra-Deepwater by J-lay Method Choi, H.S.
  8. Int. J. of Ocean Engineering and Technoligy v.2 no.1 Conceptional Design of Next Generation J-lay System Choi, H.S.;McDonald, D.N.
  9. Det Norske Veritas Offshore Standard OS-F101 Submarine Pipeline Systems DNV
  10. Det Norske Veritas Offshore Standard OS-F201 Dynamic Risers DNV
  11. Det Norske Veritas Recommended Practice C203 Fatigue Strength Analysis of Offshore Steel Structures DNV
  12. Deepwater Technology Conference API and DNV Pipeline Design Rules Recently Updated Kopp, F.;Peek, R.