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KrF 엑시머 레이저를 이용한 용융실리카의 미세 습식 식각가공

Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching

  • 백병선 (강원대학교 기계메카트로닉스공학부 대학원) ;
  • 이종길 (한국산업기술대학교 기계공학과) ;
  • 전병희 (인덕대학교 컴퓨터응용 기계계열) ;
  • 김헌영 (강원대학교 기계메카트로닉스공학부)
  • 발행 : 2002.11.01

초록

Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.

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참고문헌

  1. Silicon Micromachining M. Elwenspoek;H. Jansen
  2. LPM2000 Advanced lasers for photonic device microfabrication P.R. Herman;K.P. Chen;P. Corkun;A. Naumov;S. Ng;J. Zhang
  3. Jpn. J. Appl. Phys. v.36 Formation of Elastic Cone-Like Microstructures on the Composite of ELastomer and Carbon Black by Excimer Laser Ablation S. ONO;S. Nakaoka;J. Wang;H. Niino;A. Yabe https://doi.org/10.1143/JJAP.36.L1387
  4. Industrial Application of Lasers J. F. Ready
  5. Proc. of SPIE v.4088 Micromachining of Transparent Materials by Laser Ablation of Organic Solution J. Wang;H. Niino;A. Yabe https://doi.org/10.1117/12.405687
  6. LPM2000 Etching of transparent materials by laser ablation of an organic solution Jun Wang;Hiroyuki Niino;Akira Yabe