Journal of Mechanical Science and Technology

The Korean Society of Mechanical Engineers (대한기계학회)
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Molecular Dynamics Simulation of Adhesion Processes

  • Cho, Sung-San (Department of Mechanical and System Design Engineering, Hongik University) ;
  • Park, Seungho (Department of Mechanical and System Design Engineering, Hongik University)
  • Published : 2002.11.01
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Abstract

Adhesion of a hemispherical tip to the flat surface in nano-structures is simulated using the molecular dynamics technique. The tip and plates are modeled with the Lennard-Jones molecules. The simulation focuses on the deformation of the tip. Detailed descriptions on the evolution of interaction force, the energy dissipation due to adhesion hysteresis, the forma- tion-growth-breakage of adhesive junction as well as the evolution of molecular distribution during the process are presented. The effects of the tip size, the maximum tip approach, the tip temperature, and the affinity between the tip and the mating plate are also discussed.

Keywords

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