한국표면공학회지 (Journal of the Korean institute of surface engineering)

  • 제35권1호
  • /
  • Pages.17-32
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  • 2002
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  • 1225-8024(pISSN)
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  • 2288-8403(eISSN)
한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지

펄스 도금법을 이용한 STS 316L 스테인리스강 상의 저온 염욕 알루미늄 코팅에 관한 연구

Study of the Al-coating on the STS 316L Stainless Steel by Pulse Plating in the Molten Salts at Room Temperature

  • 정세진 (영남대학교 재료금속공학부) ;
  • 조계현 (영남대학교 재료금속공학부)
  • 발행 : 2002.02.01
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초록

Electroplating methods by molten salts and non-aqueous melts were employed for aluminium coating on STS 316L stainless steel. After coated with Ni or non-coated surface on stainless steel, Al pulse plating was carried out in two different types of electrolytes at room temperature. The Al layer from $AlCl_3$-TMPAC melts could not obtain appreciable thickness for engineering application due to chemical reactions between deposits and moisture of air. However, The Al coating by pulse plating in the Ethylbenzene-Toluene-$AlBr_3$ systems was found to be solid coating layer with a few $\mu\textrm{m}$ scale. The conductivity of Ethylbenzene-Toluene-$AlBr_3$ electrolyte was as functions of time and agitation. By seven days exposure after mixing of the electrolyte, Al-deposited layer shows uniform and near by pore-free with high current density (higher than 30mA/$\textrm{cm}^2$). The roughness and imperfection of coating layer were decreased with a increasing agitation speed. It was found that the optimum condition for the Al pulse plating on the 316L stainless steel was a 400mA peak current, duty cycle, $t_{on}$ $t_{ off}$=3ms/1ms, and a current density of 30mA/$\textrm{cm}^2$.

키워드

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