References
- Optoelectronics Packaging Workshop Equipment Deve-lopments and Issues for Assembly Bruce W. Hueners
- J. Lightwave Tech v.12 Packaging Technology for a 10-Gb/s Photoreceiver Module Y. Oikawa;H. Kuwatsuka;T. Yama-moto;T. Ihara;H. Hamano;T. Minami
- Microelectronics packaging handbook Rao R. Tummala;Eugene J. Ryma-szwski
- Global technical and commercial developments with flip chip technology, 1996 ECTC Carles L. Lassen
- Optoelec-tronics Packaging ALAN R. MICKELSON