참고문헌
- Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on High Aspect Ratio Si Etching Technique and Application D. Zhang;J. Wan;G. Yan;T. Li;D. Tian;K. Deng
- MEMS99 Bosch Deep Silicon Etching : Improving Uniformity and Etch Rate for Advanced MEMS Applications F. Laermer;A. Schilp;K. Funk;M. Offenberg;R. B. GmbH
- Surface and Coatings Tech. v.97 Reactive Ion Etching for High Aspect Ratio Silicon Micromachining I. W. Rangelow https://doi.org/10.1016/S0257-8972(97)00284-3
- J. of Microelec. Sys. v.9 High Aspect-ratio Combined Poly and Single-crystal Silicon (HARPSS) MEMS Technology F. Ayazi;K. Najafi https://doi.org/10.1109/84.870053
- J. the Institute of Elect. Mater. Eng. v.11 no.9 A Study on the High Selective Oxide Etching Using Inductively Coupled Plasma Source S. B. Lee;H. G. Park;S. H. Lee
- Applied Surface Sci. v.100-101 Deep Trench Etching in Silicon with Fluorine Containing Plasmas P. Verdonck;R. D. Mansano;H. S. Maciel https://doi.org/10.1016/0169-4332(96)00343-1
- J. Micromechanics v.5 The Black Silicon Method H. Jansen;M. de Boer;M. Elwenspoex https://doi.org/10.1088/0960-1317/5/2/015
- J. Vac. Sci. Technol. v.B10 Microscopic Uniformity in Plasma Etching R. A. Gottscho;C. W. Jurgenson;D. J. Kitkavage https://doi.org/10.1116/1.586180
- J. Kor. Institute of Chem. Eng. v.31 Study on the Etching Reaction of Silicon with Carbon Tetrafluoride in Electron Cyclotron Resonance Plasma Etching System M. H. Yun;C. B. Kim;K. S. Nahm;S. M. Lee;W. I. Park;K. B. Lee
- J. Vac. Sci. Tech. v.A11 Etching of Si with Cl₂Using an Electron Cyclotron Resonance Source K. T. Sung;S. W. Pang https://doi.org/10.1116/1.578494
- Plasma Sci., IEEE Transactions on v.28 A Computational Investigation of The Effects of Varying Discharge Geometry for an Inductively Coupled Plasma A. J. Christlieb;W. N. G. Hitchon;E. R. Keiter https://doi.org/10.1109/27.902250
- J. Vac. Sci. Tech. v.B18 Comparision of Cl₂and F-based Dry Etching for High Aspect Ratio Si Microstructures Etched with an Inductively Coupled Plasma W. C. Tian;J. W. Weigold;S. W. Pang
- Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on v.1 ICP Dry Etching for Deep Sub-micrometer Vertical Trench in Si and SiO₂ W. Ke;L. X. Chun;G. X. Xu;W. R. Mei;C. Z. Ya
피인용 문헌
- Parameter study for silicon grass formation in Bosch process vol.28, pp.1, 2010, https://doi.org/10.1116/1.3280131