Journal of Institute of Control, Robotics and Systems (제어로봇시스템학회논문지)

Institute of Control, Robotics and Systems (제어로봇시스템학회)
권호 표지
DOI QR코드

DOI QR Code

A 3D Solder Paste Inspection System Using Multiple Slit Rays

다중 슬릿광을 이용한 3차원 Solder Paste 검사 시스템

  • Published : 2002.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

A 3-dimenstional automatic solder paste inspection system is described that can be used to find defects occurring in solder paste printing process. This system extracts height and volume information very fast as well as area of solder paste printed, using multiple slit ray projection and Galvano-mirror scanning. Methods are presented on calibration of camera and slit projector, real-time image processing of multiple slit images, determination of reference height, and extraction of paste height information are proposed. Performance of the system was successfully demonstrated through field tests.

Keywords

References

  1. David J. Clark, 'Solder paste process control,' Circuit Assembly, Jan., 1995
  2. Chuck Gamble, '3-D laser inspection technology,' SVS Technical Reports, 1995
  3. Charles-Henri Mangin, 'Where quality is lost on SMT boards,' Circuit Assembly, Feb., 1991
  4. S. F. Krmani and G. D. Foote, 'Solder paste critical parameter measurement in surface mount boards using model-based vision processing techniques,' Proc. Applied Machine Vision '94, Society of Manufacturing Engineers, Minneapolis, Minnesota, June 6-9, 1994
  5. L. di Stefano and F. Boland, 'Solder-paste inspection by structured light methods based on phase measurement,' Proc. SPIE vol. 2899, Automated Optical Inspection for Industry, pp. 702-713, 1996 https://doi.org/10.1117/12.253007
  6. J. L. Horijon, F. C. Couweleers, and W. D. van Amstel, 'Largescale high-resolution 3D laser scanner for solder-paste inspection,' Proc. SPIE, vol. 2774, Design and Engineering of Optical Systems, pp. 526-534, 1996 https://doi.org/10.1117/12.246699
  7. 吉澤撤, 光三次光計測, 新技術コミュニケ-ションズ, 1999