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A 3D Solder Paste Inspection System Using Multiple Slit Rays

다중 슬릿광을 이용한 3차원 Solder Paste 검사 시스템

  • Published : 2002.02.01

Abstract

A 3-dimenstional automatic solder paste inspection system is described that can be used to find defects occurring in solder paste printing process. This system extracts height and volume information very fast as well as area of solder paste printed, using multiple slit ray projection and Galvano-mirror scanning. Methods are presented on calibration of camera and slit projector, real-time image processing of multiple slit images, determination of reference height, and extraction of paste height information are proposed. Performance of the system was successfully demonstrated through field tests.

Keywords

References

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