Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
권호 표지
DOI QR코드

DOI QR Code

Deformation Analysis of Composits-Patched Concrete Using Moire Interferometry

무아레 간섭계를 이용한 복합재 보강 콘크리트의 변형해석

  • Published : 2002.01.01
Download PDF
⟨ Previous Next ⟩

Abstract

Many of aged and damaged concrete structure have been revitalized with composite reinforcement. Flexural behaviors of composite-patched concrete specimens are characterized by high-sensitivity moire interferometry. The three-mirror, four-beam interferometry system and a compact loading system are used for obtaining singe patterns representing whole-field contour maps of in-plane displacements. It is seen from the calibration test for the loading system that the measured bending displacement is in excellent agreement with the displacement calculated by the beam theory. The crack opening displacement as well as the bending and the horizontal displacement fur the notched and unnotched specimen are investigated. The results also show that the notched specimen reinforced by a composite sheet has sufficient stiffness and strength compared to the original concrete specimen.

Keywords

References

  1. Howie, I., 1995, 'Effect of Tow Sheet Composite Wrap Architecture on Strengthening of Concrete due to Confinement:Ⅰ-Experimental Studies,' J. of Reinforced Plastics and Composites, Vol. 14, pp. 1008-1030 https://doi.org/10.1177/073168449501400906
  2. Calado, L., Castiglioni, C. A. and Agatino, M. R., 1997, 'Experimental and Numerical Evaluation of Bond Stress of Concrete Beam Reinforced by GFRP Bars,' Proc. ICCM-11, Vol. Ⅵ, pp. 731-739
  3. Kimpara, I., Kageyama, K., Suzuki, T., Ohsawa, I. and Yamaguchi, K., 1997, 'Experimental Characterization of Reinforcing Effects of FRP Sheets Bonded on Mortar and Concrete Beams,' Proc. ICCM-11, Vol. Ⅵ, pp. 16-25
  4. 이효재, 황재석, Shimamoto. A., 1999, '투과형 광탄성 실험법에 의한 지능석 FRP 파괴지연 효과에 관한 연구,' 대한기계학회 논문집 A권, 제23권, 제11호, pp. 1904-1911
  5. 정성균, 이승환, 임승규, 장석원, 1999, 'ESPI를 이용한 복합재료의 충간분리 검출,' 대한기계학회 논문집 A권, 제23권, 제12호, pp. 2103-2108
  6. Post, D., Han, B. and Ifju, P.,1994, High Sensitivity Moire: Experiental Analysis for Mechanics and Materials, Springer-Verlag, New York
  7. Guo, Y., Post, D. and Han, B., 1992, 'Thich Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties,' J. Composite Materials., Vol. 26, No. 13, pp. 1930-1944 https://doi.org/10.1177/002199839202601304
  8. Ifju, P. G., Masters, J. E. and Jackson, W. C., 1995, 'Using Moire Interferometry to Aid in Standard Test Method Development for Texile Composite Materials,' Composite Science and Technology, Vol. 53, pp. 155-163 https://doi.org/10.1016/0266-3538(95)00014-3
  9. Dadkhah, M. S. and Kobayashi, A. S., 1989, 'HRR Field of a Moving Crack, An Experimental Analysis,' Engineering Fracture Mechanics, Vol. 34, pp. 253-262 https://doi.org/10.1016/0013-7944(89)90258-0
  10. Perry, K. E. and McKelvie, J., 1996, 'Measurement of Energy Release Rates for Delaminations in Composite Material,' Experimental Mechanics, vol. 36, pp. 55-63 https://doi.org/10.1007/BF02328698
  11. Post, D., Wood, J. D., Han, B.;Parks, V. J. and Gerstle, Jr., F. P., 1994, 'Thermal Stresses in a Bimaterial Joint: An Experimental Analysis,' J. Applied Mechanics. Trans. ASME. Vol. 61, No. 1, pp. 192-198 https://doi.org/10.1115/1.2901397
  12. Guo, Y., Lim, C. K., Chen, W. T. and Woychik, C. G., 1993, 'Solar Ball Connect (SBC) Assembiles under Thermal Loading:Ⅰ. Deformation Measurement via Moire Interferometry, and Its Interpretation,' IBM J. Research and Development, Vol. 37, No. 5, pp. 635-648 https://doi.org/10.1147/rd.375.0635
  13. Han, B and Guo, Y., 1995, 'Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscopic Moire Interferometry,' J. Electronic Packaging, Trans. ASME, Vol. 117, pp. 185-191 https://doi.org/10.1115/1.2792090
  14. Han, B., 1998, 'Recent Advancements of Moire and Microscopic Moire Interferometry for Thermal Deformation Analysis of Microelectronics Devices,' Experimental Mechanics, Vol. 38, No. 4, pp. 278-287 https://doi.org/10.1007/BF02410390