Journal of Welding and Joining

  • 제19권4호
  • /
  • Pages.406-412
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  • 2001
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

Sn-37mass%Pb 솔더 및 Sn-3.5mass%Ag 무연솔더를 이용한 ${\mu}BGA$ 솔더접합부의 열피로수명 예측

Thermal Fatigue Life Prediction of ${\mu}BGA$ Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder

  • 신영의 (중앙대학교 기계공학부) ;
  • 이준환 (중앙대학교 기계공학부) ;
  • 하범용 (중앙대학교 기계공학부) ;
  • 정승부 (성균관대학교 금속재료공학부) ;
  • 정재필 (서울시립대학교 재료공학과)
  • 발행 : 2001.08.01
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초록

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

키워드

참고문헌

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