참고문헌
- 대한기계학회논문집 A권 v.22 no.7 정전기력을 이용한 마이크로가속도 센서 축전기부의 주울 발열에 의한 온도 분포 해석 김옥삼
- Journal of KSME v.33 no.6 Micromcahining Technologies of MEMS C. J. Kim
- Impact of MEMS Technology on Society J. Bryzek
- FastCap User325s Guid, Reserch Laboratory of Electronics K. Nabors;S. Kim;J. White;S. Senturia
- SENSIM : A Simulation Program for Sold-State Pressure sensors K. W. Lee;K. D. Wise
- 한국박용기관학회 2000년 춘계학술대회 논문집 마이크로가속도계의 열응력에 대한 유한 요소 해석 김옥삼
- International Conference on Meterials and Mechanics'97 Finite Element Analyses of Residual Stress Causing Popping up of Microaccelerometer Based on Tunneling Current Concept O. S. Kim;S. Yoshimura;G. Yagawa
- KSME International Journal v.12 no.6 A Study on the Thermal Behavior in Microaccelcrometer Manufactuaring Processes O. S. Kim
- A Francture Testing of Bulk Silicon Microncantilever Beams Subjected to a Side Load v.68 J. C. Wilson;K. Patricia
- Fracture testing of silicon C. J. Wilson;A. Ormeggi;M. Narbutovskih
- Fracture testing of silicon micro cantilever beams v.79 no.5 C. J. Wilson;A. Ormeggi;M. Narbutovskih