A Study on the Grinding Characteristics of the Quartz

Quartz의 연삭 특성에 관한 연구

  • 임종고 (금오공과대학교 기계설계공학과 대학원) ;
  • 하상백 (금오공과대학교 기계설계공학과 대학원) ;
  • 김성헌 (금오공과대학교 기계설계공학과 대학원) ;
  • 최환 (금오공과대학교 기계공학부) ;
  • 이종찬 (금오공과대학교 기계공학부)
  • Published : 2001.07.01

Abstract

This study reports the grinding characteristics of quartz. Grinding experiments were performed at various grinding conditions including wheel mesh, table speed and depth of cut. The grinding forces and specific grinding energies were measured. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM. A new parameter SDR(Surface roughness Direction Ratio) is proposed to characterize the grinding mechanisms of quartz. A set of experiments was performed to verify the effectiveness of the suggested parameter. The experimental results indicate that the ductile mode is the dominant material removal mode at the grinding conditions which show the higher value of SDR whereas the material is removed by brittle fracture in a lower value of SDR value increases with wheel mesh size.

Keywords

References

  1. Malkin, S., 'Grinding Technology : Theory and Application of Machining with Abrasives,' John wiley & Sons, New York, 1992
  2. Hwang, T.W., Malkin S., 'Grinding Mechanical and Energy Balance for Ceramics,' Transaction of the ASME, Vol. 121, 1999
  3. Malkin, S., Hwang, T. W., 'Grinding Mechanisms for Ceramics,' Annals of the CIRP, Vol. 45, 1996 https://doi.org/10.1016/S0007-8506(07)60511-3
  4. Ritter, J. E., Malkin, S., 'Grinding Mechanisms and Strength Degradation for Ceramics,' Transaction of the ASME, Vol. 111, 1989
  5. Pei, Z. J., Billingsley, S. R., Miura,S., 'Grinding induced subsurface cracks in silicon wafers,' International Journal of Machine Tools & Manufacture, Vol. 39, 1999 https://doi.org/10.1016/S0890-6955(98)00079-0
  6. Bifano, T. G., Hosler, J. B., 'Precision Grinding of Ultra-Thin Quartz Wafers,' Transactions of the ASME, Vol. 115, 1993
  7. Sang Baek Ha, Young Kil Jeon, Whan Choi, and Jong Chan Lee, 'A Study on the Grinding Characteristics of Ceramics,' Journal of the Korean Society of Precision Engineering, Vol. 103, 1999