The Journal of Korean Academy of Prosthodontics (대한치과보철학회지)
- Volume 38 Issue 3
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- Pages.328-335
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- 2000
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- 0301-2875(pISSN)
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- 2005-3789(eISSN)
A qualitative analysis of bonding between electroformed surface and veneering ceramics
- Kwon, Ho-Beom (Department of Prosthodontics, School of Medicine, Sungkyunkwan University) ;
- Yim, Soon-Ho (Department of Prosthodontics, School of Medicine, Sungkyunkwan University)
- Published : 2000.06.01
Abstract
Statement of the problem. Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. Purpose of study. The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. Methods/material. Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. Conclusion. With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.
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