한국주조공학회지 (Journal of Korea Foundry Society)

  • 제20권2호
  • /
  • Pages.116-121
  • /
  • 2000
  • /
  • 1598-706X(pISSN)
  • /
  • 2288-8381(eISSN)
한국주조공학회 (Korea Foundry Society)
권호 표지

In, Bi가 첨가된 Sn-9wt.%Zn/Cu 접합부의 납땜성 및 기계적 성질

The Solderability and Mechanical Properties of In, Bi Added Sn-9Zn/Cu Joint

  • 백대화 (전남대학교 공과대학 금속공학과) ;
  • 이경구 (한려대학교 신소재공학과) ;
  • 이도재 (전남대학교 공과대학 금속공학과)
  • Baek, Dae-Hwa (Dept. of Metallurgical Engineering, Chonnam Nat.jonal University) ;
  • Lee, Kyung-Ku (Dept. of Advanced Material Engineering, Hanlyo University) ;
  • Lee, Doh-Jae (Dept. of Metallurgical Engineering, Chonnam Nat.jonal University)
  • 발행 : 2000.04.20
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초록

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

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