Phosphine oxide와 불소를 함유하는 폴리이미드의 접착성 연구

Adhesive Property of Novel Polyimides Containing Fluorine and Phosphine Oxide

  • 정관운 (광주과학기술원 신소재공학과) ;
  • 명범영 (광주과학기술원 신소재공학과) ;
  • 조영준 (광주과학기술원 신소재공학과) ;
  • 최익준 (광주과학기술원 신소재공학과) ;
  • 윤태호 (광주과학기술원 신소재공학과)
  • Jeong, K.U. (Department of Materials Science and Engineering, Kwangju Institute of Science and Technology) ;
  • Myung, B.Y. (Department of Materials Science and Engineering, Kwangju Institute of Science and Technology) ;
  • Cho, Y.J. (Department of Materials Science and Engineering, Kwangju Institute of Science and Technology) ;
  • Choi, I.J. (Department of Materials Science and Engineering, Kwangju Institute of Science and Technology) ;
  • Yoon, T.H. (Department of Materials Science and Engineering, Kwangju Institute of Science and Technology)
  • 투고 : 2000.07.09
  • 심사 : 2000.08.18
  • 발행 : 2000.09.26

초록

Phosphine oxide와 불소를 함유하는 단량체(bis(3-aminophenyl) 3,5-bis (trifluoromethyl) phenyl phosphine oxide (mDA6FPPO))를 Grignard 반응에 의하여 합성한 다음, 이를 PMDA, 6FDA, BTDA 또는 ODPA와 함께 폴리이미드 합성에 사용하였다. 폴리이미드는 폴리아믹산을 합성한 후 이를 이미드화시키는 방법을 사용하였으며, FT-IR, NMR, DSC 및 점도측정기를 이용하여 분석하였다. 또한 T-peel 시험으로 접착강도를 측정하였다. Phosphine oxide를 함유하는 bis(3-aminophenyl) phenyl phosphine oxide (mDAPPO) 및 상용의 3.3'-diamino diphenyl sulfone (mDDS)로부터 합성된 폴리이미드와 비교하였다. 본 연구에서 합성된 mDA6FPPO를 사용하여 만들어진 폴리이미드는 높은 $T_g$, 우수한 용해도 및 접착성을 보였다.

A novel diamine monomer, containing fluorine and phosphine oxide, bis(3-aminophenyl) 3,5-bis(trifluoromethyl) phenyl phosphine oxide (mDA6FPPO), was prepared via Grignard reaction, and utilized to prepare polyimides with dianhydrides such as PMDA, 6FDA, BTDA or ODPA, by the conventional two-step route; preparation of poly(amic acid), followed by solution imidization. The polyimides were characterized by FT-lR, NMR, DSC and DMA, with intrinsic viscosity, and adhesive properties were also evaluated. A phosphine oxide containing monomer, bis(3-aminophenyl) phenyl phosphine oxide (mDAPPO) a nd a commercial 3,3'-diamino diphenyl sulfone (mDDS) were also used for comparison. The polyimides with mDA6FPPO exhibited high $T_g$, excellent solubility, and good adhesive properties.

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