Effects of the Inclined Angles of Channel on Thermal Stability of Electronic Components

채널의 경사각이 전자부품의 열적 안정성에 미치는 영향

An experimental study was carried out to investigate the effects of inclined angles of channel on thermal stability of electronic components. In this study, it is focused on the natural convection heat transfer from an inclined parallel channel with discrete protruding heat sources. The material used for the inclined parallel channel was epoxy-resin, while air as the cooling fluid. Heat transfer phenomena for inclined angles of $\psi$=$15^{\circ}$, $30^{\circ}$, $45^{\circ}$, $60^{\circ}$ and for the range of $9.52{\times}10^5/ were analyzed. The thermal fields in the channel were visualized by Mach-Zehnder interferometer. Also, local temperatures were measured by thermocouples along the channel wall and heat sources surface. As a result, for the range of $4.29{\times} 10^5/, a useful correlation of mean Nusselt number was proposed as a function of modified channel Rayleigh number.