Transactions on Electrical and Electronic Materials
- 제1권3호
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- Pages.23-28
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- 2000
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- 1229-7607(pISSN)
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- 2092-7592(eISSN)
Improvement of Adhesion Strength between Cu-based Leadframe and Fpoxy Molding Compound
- Lee, Ho-Yoing (The George W. Woodruff School of Mechanical Enginnering, Georgia Institute of Technology, Atlanta)
- 발행 : 2000.09.01
초록
A block-oxide layer was formed on the surface of Cu-based leadframe by chamical oxidation method in order to enhance the adhesion strength between Cu-based leadframe and epoxy molding compound (EMC) Using sandwiched double cantilever beam (SDCB) specimens, the adesion strength was measured in terms of interfacial fracture toughness, G
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