Abstract
In this work, cure behavior and thermal stability of epoxy (EP)/polysulfone (PSF) blends were investigated using DSC and TGA. The 4,4'diaminodiphenyl sulfone (DDS) was used as a curing agent for epoxy resin and the content of EP/RSF was varied within 100/0∼100/40 phr. Cure activation energy ($E_{a}$) and conversion (α) were determined by dynamic and isothermal DSC. Based on the DSC results of EP/PSF blend system, $E_{a}$ increased with increasing PSF contents up to 30∼40 phr. However, the conversion decreased as the PSF content increased. From the TGA results of EP/PSF blends, the thermal stability based on initial decomposition temperature(IDT), integral procedural decomposition temperature(IPDT), and decomposition activation energy ($E_{t}$) were investigated. The thermal stabilities were increased by increasing the PSF content based on epoxy neat resin up to 30 phr of PSF. However, the presence of 40 phr PSF in the blend system led to a decrease in thermal stability, due to the immisciblity between EP and PSF.
